Accelerate AMD EPYC™ and Ryzen™ Embedded processors’ power-delivery validation with platform-specific interposers, Pactiv-R test systems and expert Test-as-a-Service support.
SP7, FL1, FP8 and FP11 are all available now. · Testing in Asia from January 2027
Test-as-a-Service (TaaS)
Nothing to buy for socketed boards: ProGrAnalog supplies the SP7 interposers and the M-M connector. BGA boards need the interposer for your platform.”
Check fit
Go to the AMD TIP (Technical Information Portal) and download the ProGrAnalog drawing and STEP model for your platform. Check your board’s keep-outs and component heights around the processor, so the interposer, M-M connector and Pactiv-R head fit.
No TIP access? Ask your AMD FAE / SAE.
Request a quote
Send the request form: platform, target date and your AMD FAE / SAE. ProGrAnalog replies with a quote and a test date.
Place the order
Send ProGrAnalog a purchase order for the test, any BGA interposers, and the reflow if we do it. For TaaS, ProGrAnalog supplies the socketed interposers (SP7) and the M-M connector.
Prepare and ship the board
Your board takes one of these three routes, depending on the package and who does the reflow.
No reflow needed
OR
ProGrAnalog reflows
OR
You reflow
Test and report
Your board is tested on Pactiv-R, in its own chassis. You receive the AMD format report and the board is returned.
Can the test wait until mid-January 2027?
| Where it is tested | How it is ordered | |
|---|---|---|
| No — test now | ProGrAnalog, Portland, Oregon (boards ship from any region) | The test and any BGA interposers ordered from ProGrAnalog |
| Yes — from mid-January 2027 | Chroma or Forenext lab in Taiwan or Mainland China | The test from ProGrAnalog; BGA interposers from ProGrAnalog, or from Chroma or Forenext once they stock them |
| Europe | ProGrAnalog Europe (Netherlands / UK — location TBC) | The test from ProGrAnalog |
Boards from Europe ship to Portland until a European facility opens.
What happens at the lab, from interposer to report.
1 Fit the interposer
BGA packages (FL1, FP8, FP11): the interposer is reflowed onto the board in place of the processor. LGA sockets (SP7): the interposer seats in the socket, no soldering.
2 Connect Pactiv-R
The Pactiv-R head mates to the interposer through the M-M connector. The interposer’s ID memory tells the head which processor it is.
3 Run the test
The board runs in its own chassis. Pactiv-R applies static and transient loads to each supply rail at the processor pins, with remote sense on every rail.
4 Generate the report
The system writes the AMD format report during the session: pass or fail for every rail, dynamic and static analysis, load line. The customer submits it to AMD.
Summary and test settings
Dynamic analysis
Static analysis
A complete platform support path covering high-performance socketed processors, BGA package access and outsourced power-delivery testing.
Platforms
SP7 / FL1
Package
SP7 (socketed) / FL1 (BGA)
Test equipment
Pactiv-R
Availability
Now
Platforms
FP8 / FP11
Package access
BGA
Availability
Now
location
Portland, OR (Asia from January 2027)
inputs
Customer board, AMD FAE / SAE
Good for?
Teams that need a scheduled validation engagement without establishing a complete internal test environment.
Platform-specific interposers and Test-as-a-Service on Pactiv-R, designed to quickly evaluate, characterize and validate power-delivery schemes for AMD EPYC™ and Ryzen™ Embedded processors.
Where each AMD x86 Embedded platform stands today. More platforms will be added as AMD announces them.
Available
BGA package access and power-delivery validation support.
Available
BGA package access and power-delivery validation support.
Available
BGA package access and power-delivery validation support.
Tell ProGrAnalog which processor you need, when testing must begin and the expected regional demand.
